| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68327
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-6834
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-308
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2457-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-162
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2405-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2250-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2423-006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-312
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-2848
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-28 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6835
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B7-028
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-08 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B7-028 |
| filingDate |
2007-08-09^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_48a4dcb99baabc746c665fdbef6b5e6f |
| publicationDate |
2008-02-13^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-1887061-A2 |
| titleOfInvention |
Pressure-sensitive adhesive sheets for wafer grinding |
| abstract |
The present invention relates to a pressure-sensitive adhesive sheet for semiconductor wafer processing, which includes a substrate and a pressure-sensitive adhesive layer disposed on the substrate, the pressure-sensitive adhesive sheet or said substrate having a thermal shrinkage ratio of 2% or lower after having been allowed to stand at 60°C for 10 minutes. This pressure-sensitive adhesive sheet preferably has a degree of elongation of 2% or lower in a silicon wafer application test of the pressure-sensitive adhesive sheet. According to this pressure-sensitive adhesive sheet, the back side of a semiconductor wafer can be ground to an extremely small thickness without bending the wafer. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011097576-A1 |
| priorityDate |
2006-08-10^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |