| abstract |
To provide resin particles which are excellent in electrostatic properties, thermal resistance storage stability, and thermal properties and have uniform particle diameter. The invention is the resin particles (D) having a structure formed by depositing resin particles (A) comprising a first resin (a) having an initial softening temperature of 40 to 270°C, a glass transition temperature of 20 to 250°C, a flow temperature of 60 to 300°C, and difference of the glass transition temperature and the flow temperature in a range of 0 to 120°C or a film (P) comprising the resin (a) on the surfaces of resin particles (B) comprising a second resin (b), wherein the surface coverage of the resin particles (B) with the resin particles (A) or the film (P) is 0.1 to 4.9%. |