Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_23bc9f8ad08b9e20c0ec3cf34d940551 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31053 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3105 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-321 |
filingDate |
2007-12-21^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d0f48a467b783ca535aa2082cae57786 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b40832af18ea15a263dc66a9fca9ba8b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e0fd2bfb5b413e5f0a5bf951499e0610 |
publicationDate |
2008-06-25^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
EP-1936674-A2 |
titleOfInvention |
Method and slurry for tuning low-k versus copper removal rates during chemical mechanical polishing |
abstract |
A composition and associated method for the chemical mechanical planarization (CMP) of metal substrates on semiconductor wafers are described. The composition contains a nonionic fluorocarbon surfactant and a per-type oxidizer (e.g., hydrogen peroxide). The composition and associated method are effective in controlling removal rates of low-k films during copper CMP and provide for tune-ability in removal rates of low-k films in relation to removal rates of copper, tantalum, and oxide films. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8405955-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2012046179-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/RU-2589482-C2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9070632-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3628714-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2625236-A4 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2625236-A1 |
priorityDate |
2006-12-21^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |