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filingDate 2007-12-21^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d0f48a467b783ca535aa2082cae57786
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publicationDate 2008-06-25^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber EP-1936674-A2
titleOfInvention Method and slurry for tuning low-k versus copper removal rates during chemical mechanical polishing
abstract A composition and associated method for the chemical mechanical planarization (CMP) of metal substrates on semiconductor wafers are described. The composition contains a nonionic fluorocarbon surfactant and a per-type oxidizer (e.g., hydrogen peroxide). The composition and associated method are effective in controlling removal rates of low-k films during copper CMP and provide for tune-ability in removal rates of low-k films in relation to removal rates of copper, tantalum, and oxide films.
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