| abstract |
A composition for removing photoresist and etching residue comprising: nat least 50% by weight of an organic solvent comprising nan alkylene glycol ether; and nat least one solvent selected from propylene glycol, glycerol, ethylene glycol, polyvinyl alcohol, ethyl lactate and N,N-dimethylacetamide; na source of fluorine; nup to 49.9% by weight of water; and noptionally up to 20% by weight of a corrosion inhibitor. |