| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_781c429e4e20536916ff74dcbe1b5417 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12535
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0154
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-381
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31721
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0346
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0344
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-2063 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1651
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-2006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-388
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C28-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-204
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-088 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-088
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C28-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24 |
| filingDate |
2010-02-17^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d4b2da3a5480daceb56b057319c9d0f0 |
| publicationDate |
2012-01-04^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-2402485-A1 |
| titleOfInvention |
Metal-coated polyimide resin substrate with excellent thermal aging resistance properties |
| abstract |
[Object] To provide a metal-coated polyimide resin substrate that does not deteriorate the initial adhesion between the metal-coated polyimide resin film and the metal layer and has high adhesion after aging at 150°C for 168 hours. n [solution] A metal-coated polyimide resin substrate in which a barrier layer is formed by a wet process after performing surface modification to one surface or both surfaces of a polyimide resin film by a wet process or a dry process or a combination thereof, a seed layer is thereafter formed by a wet process or a dry process, and a conductive film is formed on a surface layer thereof by a wet process; wherein, at the peeling surface on the conductive film layer side after the metal-coated polyimide resin substrate is subject to a 90-degree peel test, the thickness of a mixed layer of polyimide; residue and barrier metal layer residue according to in-depth profiting with a time-of-flight secondary ion mass spectrometer (TOF-SIMS) is 2.60 nm or less based on Si sputter rate conversion, and peel strength retention after an aging test at 150°C for 168 hours (peel strength after aging at 150°C for 168 hours/initial peel strength) is 50% or higher. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2012156388-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8293331-B2 |
| priorityDate |
2009-02-25^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |