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inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cd30326612c67d2ab667e9e039110ca0
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publicationDate 2012-06-27^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber EP-2469992-A1
titleOfInvention Method for obtaining a palladium surface finish for copper wire bonding on printed circuit boards and IC-substrates
abstract The present invention relates to a method of bonding a copper wire to a substrate, particularly a printed circuit board and an IC-substrate, possessing a layer assembly comprising a copper bonding portion and a palladium or palladium alloy layer and a substrate having a copper wire bonded to aforementioned layer assembly.
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