patent/EP-2589082-A1

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2589082-A1

Outgoing Links

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filingDate	2011-06-29^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e475cb8af8f60e6df7dd2f38006ea6cd http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_077250b883afe4c69c8f62bb294794b7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3081d0722010ac6c044e67679268b413 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_93731fc4cc83c10598b3275f849952e4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_041a6ff5a5a63622dfd14983f47191e8
publicationDate	2013-05-08^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	EP-2589082-A1
titleOfInvention	Electronic devices with yielding substrates
abstract	In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.
isCitedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9231178-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9179510-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9107272-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9054290-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9426860-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9252373-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9214615-B2
priorityDate	2010-06-29^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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isDiscussedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID74971 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID128454229

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