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filingDate 2011-12-16^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d9194bdfff63eae6e51b341039bdc98d
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publicationDate 2013-10-30^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber EP-2656701-A1
titleOfInvention Method for obtaining a palladium surface finish for copper wire bonding on printed circuit boards and ic-substrates
abstract The present invention relates to a method of bonding a copper wire to a substrate, particularly a printed circuit board and an IC-substrate, possessing a layer assembly comprising a copper bonding portion and a palladium or palladium alloy layer and a substrate having a copper wire bonded to aforementioned layer assembly.
priorityDate 2010-12-23^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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