http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2871182-A1

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filingDate 2013-07-05^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8b15efa7e7addb2da308a261698628d2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d488162fe8d8b4addbfcb5fb036d8b9b
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publicationDate 2015-05-13^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber EP-2871182-A1
titleOfInvention Novolac-based epoxy compound, production method for same, composition and cured article comprising same, and use for same
abstract The present invention relates to: a novolac-based epoxy compound having an alkoxysilyl group, which compound does not require a separate silane coupling agent and exhibits a low coefficient of thermal expansion (CTE) and high glass transition in a synergistic effect, when forming a composite material by curing; a production method for same; and an epoxy composition and cured article comprising same. According to one mode of embodiment of the present invention, provided are: a novolac-based epoxy compound having an alkoxysilyl group of chemical formula I-1 to I-4; a production method for a novolac-based epoxy compound having an alkoxysilyl group of chemical formula I-1 to 1-4 by means of the epoxidation, alkenylation and alkoxysilylation of a novolac-based epoxy compound; a production method for a novolac-based epoxy compound having an alkoxysilyl group of chemical formula I-1 to 1-4 by means of the epoxidation and alkoxysilylation of a novolac-based epoxy compound; and an epoxy composition comprising a novolac-based epoxy compound having an alkoxysilyl group of chemical formula I-1 to I-4; and also provided is a cured article of same. A cured article constituted by a composite article of the composition comprising the novolac-based epoxy compound having an alkoxysilyl group of a novel kind according to the present invention has improved chemical bonding efficiency when forming an epoxy composite by means of chemical bonding between the alkoxysilyl groups of the epoxy compound having alkoxysilyl groups, not to mention chemical bonding of a filler with the alkoxysilyl groups in the epoxy compound. Consequently, a low CTE and high glass transition temperature are exhibited.
priorityDate 2012-07-06^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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