| abstract |
A semiconductor module is provided for shortening a manufacturing tact time and reduce manufacturing costs and for ensuring reliability of a bonding portion. The semiconductor module includes a substrate (31) formed of a metal, an insulating layer (32) formed on the substrate (31), a plurality of wiring patterns (33a to 33d) formed on the insulating layer (32), a bare-chip transistor (35) mounted on one wiring pattern (33a) via a solder (34a), and copper connectors (36a, 36b) that connects electrodes (S, G) formed on the bear-chip transistor (35) and other wiring patterns (33b, 33c) via a solder (34b, 34c). The copper connectors (36a, 36b) has a bridge shape, has a width-reduced portion (36ag) formed in the vicinity of the bonding face (36af) to the electrodes (S, G), and has a stress-reducing portion (36ak) formed on the bonding face (36af) bonded to the electrode (S, G). |