| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_51d028c578ae85cb937b5b34a5129fbc |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-24137
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49816
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16145
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5384
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-481
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73209
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-171
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-60 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-94
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-73
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-535
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5386
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5385
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-528
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0655
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5381 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-065 |
| filingDate |
2019-11-22^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_50e9a418836ca05f032df07e3c2e025e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5c6902334d587248807e22ebf9fe85fb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_59dc65b37a9984e3666e1d6380efd0ff
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_459c5588c5a38895656a4aded463ca3c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8e5f9b44cc5ab0dc7424bc23ae2e8a3c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7d56820afa81d0c8fc7c083e8b31a63a |
| publicationDate |
2020-07-01^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-3675164-A1 |
| titleOfInvention |
Die interconnection scheme for providing a high yielding process for high performance microprocessors |
| abstract |
A method is disclosed. The method includes a plurality of semiconductor sections and an interconnection structure connecting the plurality of semiconductor sections to provide a functionally monolithic base die. The interconnection structure includes one or more bridge die to connect one or more of the plurality of semiconductor sections to one or more other semiconductor sections or a top layer interconnect structure that connects the plurality of semiconductor sections or both the one or more bridge die and the top layer interconnect structure. |
| priorityDate |
2018-12-28^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |