http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3780100-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_14ba71eccbb5f65a22b78f39b3c6ffc3 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73263 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83365 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-33181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29294 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83385 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32227 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73215 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-13091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-92 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-293 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-84 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-83 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-26145 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-84385 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-33 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-84815 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73221 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-40499 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0603 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-85 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83815 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-40991 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-92246 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-40227 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-84365 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-072 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49575 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-4952 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K7-209 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49562 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-85 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-73 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-071 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5385 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-4334 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3677 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3735 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49568 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3107 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49537 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-18 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-495 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-488 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-538 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-373 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-07 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-98 |
| filingDate | 2020-07-30^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5ce43d1f5480f6702ff66696a8f87674 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d6cb85797a70010b0a9a98a9109cfb80 |
| publicationDate | 2021-02-17^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | EP-3780100-A1 |
| titleOfInvention | Packaged power electronic device with plural dbc substrates and assembling process thereof |
| abstract | A packaged power electronic device (50, 150) comprises: a first support element (56) having a first and a second face (56', 56"), the first face (56') of the first support element forming a first thermal dissipation surface (50A, 150A) of the device (50, 150); a second support element (57) having a first and a second face (57', 57"), the first face (57') of the second support element (57) forming a second thermal dissipation surface (50B, 150B) of the device (50, 150), the first and the second support elements (56, 57) being superimposed to each other with the respective second faces (56", 57") facing each other; a first, a second, a third and a fourth power component (51-54) (e.g., power transistors), the first and third power components (51, 53) being attached to the second face (57") of the second support element (57), the second and the fourth power components (52, 54) being attached to the second face (56") of the first support element (56); a first contacting element (60) superimposed and in electric contact with the second and the fourth power components (51, 53); a second contacting element (80) superimposed and in electric contact with the first power component (51); a third contacting element (81) superimposed and in electric contact with the third power component (54); a plurality of leads (59A-59H, 77A-77F) electrically coupled with the power components (51-54) through the first and/or the second support elements (56, 57); a thermally conductive body (93, 94) (e.g., a block of conductive material (94), such as copper, or an adhesive mass (93), such as solder) arranged between the first, the second and the third contacting elements (60, 80, 81); the second and the third contacting elements (80, 81) being arranged side by side and electrically insulated from each other; wherein the first and the second support elements (56, 57) and the first, the second and third contacting elements (60, 80, 81) are formed by electrically insulating and thermally conductive multilayers, e.g. direct bonded copper (DBC). The first, second and third contacting elements (60, 80, 81) may have a first and a second dimension that are greater than a depth dimension, the second and third contacting elements (80, 81) being adjacent to each other on a side extending along the first dimension (X) and being offset with respect to the first contacting element (60) along the second direction (Y) and optionally also in the first direction (X). The first, second, third and fourth power components (51-54) may be electrically connected to form a full-bridge. First conductive layers (80A, 81A) of the second and the third contacting elements (80, 81) may be coupled to conductive regions (58H, 58G) of the first support element (56) through a first and, respectively, a second connection pillar element (67, 68) of conductive material. The device (50, 150) may further comprise a first and a second clip element (82, 83) of electrically conductive material, the first clip element (82) extending between the first conductive layer (80A) of the second contacting element (80) and the first power component (51) and the second clip element (83) extending between the first conductive layer (81A) of the third contacting element (81) and the third power component (53), the first and the second clip elements (82, 83) having a respective projecting portion extending beyond the first and, respectively, the third power component (51, 53) and being electrically coupled at the respective projecting portion to the first and respectively the second connection pillar element (67, 68). The second and the third contacting elements (80, 81) may be longer than the first and the third power components (51, 53) and coupled at one own projecting portion to the first and respectively the second connection pillar element (67, 68). A first and a second supporting pillar portions (85) may extend between a respective projecting portion and the second support element (57) aligned with the first and, respectively, the second connection pillar elements (67, 68), the first and the second supporting pillar portions (85) being formed each by an electrically insulating and thermally conductive multilayer, e.g. DBC, and forming, with the respective first and second connection pillar elements (67, 68), a first and a second alignment and spacing structure (89). The first and the second support elements (56, 57) may further have an elongated shape with a first and a second longitudinal end, wherein the first and second alignment and spacing structures (89) are arranged in proximity to the first longitudinal end of the first and the second support elements (56, 57), the device (50, 150) comprising a third and a fourth alignment and spacing structures (90) extending in proximity to the second longitudinal end of the first and the second support elements (56, 57), wherein the third alignment and spacing structure (90) comprises a third supporting pillar portion (92) and a first supporting pillar element (91) aligned with each other and the fourth alignment and spacing structure (90) comprises a fourth supporting pillar portion (92) and a second supporting pillar element (91) aligned with each other, the third and the fourth supporting pillar portions (92) being formed each by an electrically insulating multilayer, e.g., DBC, the first and the second supporting pillar elements (91) being of conductive material. The first, second and third contacting element (60, 80, 81) and the thermally conductive body (93, 94) may form a thermal distribution structure (95), assembled before bonding with the power components (51-54). |
| priorityDate | 2019-08-01^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
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