| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3146812a1c085624a65b46fae27d81d3 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48998
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-85801
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-85874
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-85007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0278
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02P70-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45565
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10287
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48993 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-305
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-321
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B05D3-067
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-85
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-83
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-34 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-49
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-32 |
| filingDate |
2019-08-27^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_88e0dc05e794b479db6785c168c0e40b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6d226fddc676bbf33ec886d43a9c36c3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_55268526d1778626ffa73d4180c53478 |
| publicationDate |
2021-03-03^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-3787013-A1 |
| titleOfInvention |
Method of connecting an electrical conductive item with an uv curable substance, corresponding device and method of use |
| abstract |
The present invention relates to a method of manufacture of an electronic assembly comprising at least these steps: (i) Providing a substrate (101) having at least a first contact area (102); (ii) Positioning a spot (103) of a UV curable substance, e.g. an adhesive, on the substrate (101); (iii) Positioning an electrically conductive item (104) on the substrate (102) wherein the electrically conductive item (104) is superimposed on the first contact area (102) and on the spot (103) of curable substance; (iv) Exposing the UV curable substance to UV irradiation, wherein a mechanical connection between the electrically conductive item and substrate is formed; and optionally (v) connecting the first contact area (102) with the electrically conductive item (104). The invention relates further to an electronic assembly comprising a substrate (101) with a contact area (102), a spot of a cured substance (103) on the substrate (101) and a electrically conductive item (104), which electrically conductive item (104) is in electrically conductive connection with the first contact area (102) and mechanically connected through the spot of cured substance (103) to the substrate (101), as well as uses of the UV curable substance (103). |
| priorityDate |
2019-08-27^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |