http://rdf.ncbi.nlm.nih.gov/pubchem/patent/FR-2953329-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b12a35fb3e4a280efb4ddb08c07fb6c9 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-051 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-035 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2201-0191 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0109 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C3-001 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-306 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-02 |
| filingDate | 2009-12-02^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e5c6f1e2100eab2b43bb56e1f7cec6b1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bfb505eb59540c7486849b4b4d51cb6a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5a02a070ed3165b4884fbd5bf06173a5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7301a3126b14f9c808f36ff806e12cb3 |
| publicationDate | 2011-06-03^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | FR-2953329-A1 |
| titleOfInvention | METHOD AND DEVICE FOR MANUFACTURING MICROSTRUCTURE BY TRANSFER. |
| abstract | The present invention relates to a method for producing on a carrier substrate (12) a structure comprising at least one component for an electrical circuit, the method comprising at least one deposition of a component layer (11a, 9a; 11b, 9b; 11c, 9c, 7) on the carrier substrate (12), each deposit of a component layer comprising an application on the carrier substrate (12) of a component layer by means of a transfer medium (1), then fixing this component layer integrally with the carrier substrate (12), then a separation of the transfer medium (1) and this component layer. Thus, the method according to the invention can make it possible to manufacture a component layer by photolithography on a rigid silicon substrate and then to transfer a flexible carrier substrate (12), and / or to check the state of the component layer before transfer it onto the carrier substrate. In addition, the method according to the invention allows the manufacture of a thin structure. |
| priorityDate | 2009-12-02^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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