http://rdf.ncbi.nlm.nih.gov/pubchem/patent/FR-3057698-B1

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d79a3714d75520adeea100b7ed428a77
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76256
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-265
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-322
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-20
filingDate 2017-10-12^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2021-05-14^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9cd788742eefb58e3884c31b40052c82
publicationDate 2021-05-14^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber FR-3057698-B1
titleOfInvention PROCESS FOR THE PRODUCTION OF A SILICON GLUED SLICE AND SILICON GLUED SLICE
abstract There is provided a method of producing a silicon bonded wafer (100) and a silicon bonded wafer (100) which enables a getterization capability to be maintained after the silicon bonded wafer (100) has been produced and even after the bonded silicon wafer (100) has undergone another heat treatment in a device forming process or the like. The method may include a bonding step of bonding a surface of a wafer (110) used for a support substrate and a surface of a wafer (120) used for an active layer (125) according to a bonding process. vacuum at normal temperature; a thinning step of thinning the wafer (120) used for the active layer (125) and converting the thinned wafer (120) into the active layer (125); and a heat treatment step, carried out after the bonding step.
priorityDate 2016-10-14^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559541
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5461123

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