| abstract |
A printed circuit board 100 has a copper layer 104 disposed on a substrate layer 102. An organic solderability preservative (OSP) layer 106 is disposed on the copper layer 104 and is laser ablated so that a connection may be made between a component and an exposed copper surface 110. A solder or press-fit connection may be formed. The connection may be made by wire bonding, using an aluminium, copper, silver or gold bondwire 120, and may involve wedge, stich and ball, laser, or ultrasonic bonding. The organic solderability preservative 106 may be a water based compound of the azole family, such as benzotriazoles, imidazoles or benzimidazoles, and adsorbed on the copper layer 104. The organic solderability preservative layer 106 protects the copper until soldering. |