http://rdf.ncbi.nlm.nih.gov/pubchem/patent/GB-2594868-A

Outgoing Links

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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N50-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N50-80
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10B61-00
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-00
filingDate 2019-12-17^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dc5eb6fe6697a420ec418838d48b8b38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_46942ecaa97b7136e8ab7f6e4c601942
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publicationDate 2021-11-10^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber GB-2594868-A
titleOfInvention Tapered VIA structure in MTJ devices
abstract A bottom electrode structure for MRAM or MTJ-based memory cells comprises a taper so that the bottom CD is smaller than the top CD. A process of making a bottom electrode contact structure comprises etching a dielectric layer using a plasma chemistry with an increased degree of polymerization. We obtain a product made by this process.
priorityDate 2019-01-04^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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