http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2000055991-A

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filingDate 1998-08-07^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c085560a7b3c4ea72bcd5020f84f3186
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publicationDate 2000-02-25^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2000055991-A
titleOfInvention Sensor probe for board inspection and method of manufacturing the same
abstract PROBLEM TO BE SOLVED: To provide a substrate inspection apparatus and method capable of inspecting a circuit board for defects in a wide range with high resolution. An electrode layer composed of a large number of sensor electrodes (40) on a silicon flat plate base (30), a lead layer composed of a large number of lead wires (50) for transmitting signals to the outside, A method for manufacturing a sensor probe for board inspection, in which a bridge layer (41) connecting between an electrode layer and a lead wire layer is layered. The lead layer is formed on the base by depositing aluminum according to a first mask pattern, and the bridge layer is connected to each of the lead wires (50) of the lead layer while being perpendicular to the base. Each of the bridge wires (41) extending to the base is formed by growing aluminum deposition in the vertical direction of the base, It is formed. Each electrode of the electrode layer is formed by depositing aluminum according to the second mask pattern, and a plurality of sensor electrodes each extending in a horizontal direction from each bridge line and having a predetermined area. A shield layer (33) is provided between the electrode layer (40) and the lead wire layer (50).
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6967498-B2
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