http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2000138295-A

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filingDate 1999-08-17^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_afce8481505936778fd7620cf40a2c26
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publicationDate 2000-05-16^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2000138295-A
titleOfInvention Electrostatic protection device for semiconductor integrated circuit, method of manufacturing the same, and electrostatic protection circuit using electrostatic protection device
abstract (57) [Summary] [PROBLEMS] To provide an electrostatic protection device, a manufacturing method and an electrostatic protection device which can be formed without imposing any special process or photomask in a manufacturing process even when a salicide process is used. Provide an electrostatic protection circuit used. SOLUTION: The electrostatic protection device includes a thyristor and a trigger diode A for triggering the thyristor to an ON state at a low voltage. -Type cathode high-concentration impurity region 9, p-type anode high-concentration impurity region 8, n-type cathode high-concentration impurity region 9 and p-type A gate oxide film 13 formed between the gate-type anode high-concentration impurity region 8 and forming a gate of a MOS transistor of a semiconductor integrated circuit; polysilicon 14 laminated on the gate oxide film 13; And a silicide layer formed on the surface of n-type cathode high concentration impurity region 9 and a p-type anode high concentration impurity region 8 are electrically insulated from each other. And a gate sidewall insulator 12.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006080528-A
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priorityDate 1998-08-25^^<http://www.w3.org/2001/XMLSchema#date>
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