| abstract |
(57) [Problem] To provide an ultraviolet curable resin composition capable of realizing extremely high moisture resistance in hermetic sealing of a device weak to heat. SOLUTION: At least one selected from the group consisting of an epoxy compound (a) having two or more epoxy groups in one molecule, a cationic photocuring initiator (b), a plate-like inorganic filler and a flaky inorganic filler. A resin composition comprising, as essential components, an inorganic filler (c), a silane coupling agent (d), and a water absorbent (e), wherein the inorganic filler (c) Is contained in the resin composition in an amount of 20% by weight or more. |