| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76888
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76834
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76849
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76879
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76886
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76867
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53233
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53238 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-532
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205 |
| filingDate |
2000-01-14^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eda37e331bf51ff00b50a38adb38e557
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9da4c04e56689e2beb87a68959ea902a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e18bff26c0a08c3d8ed5a6d9cfea7d34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_71aa57d16c13c7beb23757b13dc1a815 |
| publicationDate |
2000-07-28^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2000208513-A |
| titleOfInvention |
Semiconductor device including copper member and method of manufacturing the same |
| abstract |
PROBLEM TO BE SOLVED: To improve the adhesion to a copper member by interposing a layer such as silicon nitride or silicon dioxide that does not completely adhere to a copper member with a layer containing germanium. SOLUTION: The layer containing germanium is copper germanide, germanium oxide, germanium nitride, or a combination thereof. The germanium-containing layer promotes the adhesion and makes it difficult for the layer that does not completely adhere to to come off the copper member. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009130369-A |
| priorityDate |
1999-01-14^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |