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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-28
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filingDate 1999-03-16^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b972e133e0403c9d4c01c81db583eadb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_224d1d6bf062fc47a572924e7815669c
publicationDate 2000-09-26^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2000265024-A
titleOfInvention Resin composition and laminate
abstract PROBLEM TO BE SOLVED: To provide a resin composition which is excellent in slipperiness at the time of melt molding, does not cause die fouling at the time of melt molding, and has excellent appearance without a die line. To provide. SOLUTION: It comprises a saponified ethylene-vinyl acetate copolymer (A), an oxide (B) and a boron compound (C).
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7285298-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7303276-B2
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2000351883-A
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013127018-A
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015110734-A
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