| abstract |
PROBLEM TO BE SOLVED: To provide a low-dielectric adhesive composition having a low relative dielectric constant, a film-forming ability, excellent adhesiveness to metal, and excellent insulation between layers, and the adhesive composition. Circuit laminated material using as an adhesive layer. SOLUTION: (A-1) component: an epoxidized copolymer composed of two or more components selected from a monomer group of styrene, butadiene, and isoprene; and (B) component: a compound having an allyl group or a methylallyl group. (C) Component: A composition containing a curable resin component. Because of its low relative dielectric constant, sufficient peel strength, and excellent heat resistance and electrical reliability, it is suitable for circuit lamination of multilayer printed wiring boards and the like. |