| abstract |
[PROBLEMS] To efficiently release a resin molded body by improving the releasability of the resin molded body with respect to a resin molding die for an electronic component. SOLUTION: For example, at least the inner surfaces of upper and lower cavities 3 and 4 and the resin passage 1 are provided on at least a surface of a mold for resin molding composed of a fixed upper die 1 and a movable lower die, which is in contact with a molten resin material. 0 Inner surface, 18 air vents, 7 recesses for setting, 7 inner surfaces of pot 8, PL surface of mold, outer surface of plunger 9, outer surfaces of ejector pins 14 and 15, ejector pin fitting holes 16 17 is formed by electroplating a nickel-tungsten alloy (NiW) plating layer A on the inner surface thereof, so that the resin molding 13 (cured resin) is harder than hard chromium plating (HCr) surface treatment. ) And the like, and the resin molded body 13 is ejected by ejector pins 14 and 15. Can be efficiently projected and released. |