patent/JP-2001185670-A

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001185670-A

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filingDate	2000-12-08^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ef75e0ddbd9a2d38963b0cf3578a1620 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_073f54e5a104bf300b0a52db7937c938 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a99c309468a14fea856bdf0f59e670e0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f9288ec37c16b4752030963ee8a28452
publicationDate	2001-07-06^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	JP-2001185670-A
titleOfInvention	Lead frame and its manufacturing method
abstract	(57) [Summary] [PROBLEMS] To provide a low-cost, high-coupling lead frame. A lead frame used in an integrated circuit chip assembly has a base metal structure having a nickel adhesive layer covering a base metal, a palladium adhesive coating on the nickel layer, and a palladium coating on the base metal structure. An adhesive layer of palladium, which selectively covers areas of the leadframe suitable for bonding wire and solder mounting.
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priorityDate	1999-12-10^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

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