| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c16d2144a81bfa32a665dca1e93c3d37 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0109
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-0242
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-019 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-0023
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01P1-023
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01P15-0802
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01C19-56 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-84
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01C19-5769
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01C19-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01P1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01P15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B7-00 |
| filingDate |
2000-11-01^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fb14378702bd5facb959fbb1d576f07f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_34d63d4fe88c0ca7fb6f0aa517e0b3ba
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_310fd9ee9765b0f2930553a7a694295b |
| publicationDate |
2001-07-10^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2001189467-A |
| titleOfInvention |
High vacuum packaging micro gyroscope and method of manufacturing the same |
| abstract |
PROBLEM TO BE SOLVED: To provide a high vacuum packaging micro gyroscope for detecting an inertial angular velocity of an object and a method of manufacturing the same. SOLUTION: A substrate on which a signal processing applied-order integrated circuit is formed and a substrate on which a micro gyroscopic suspended structure is formed are bonded in a flip type, and a signal processing applied-order integrated circuit is micro-adhered. Cost reduction by minimizing the area of the device by integrating three-dimensionally in the upper layer of the gyroscopic suspension structure and extracting each internal electrode to the outside through the polysilicon wiring formed in the double insulating film The effect is very high, and the wiring between the micro-gyroscopic suspension structure and the custom-made integrated circuit is shortened, and the noise generated by the longer wiring can be basically removed, thereby maximizing the signal sensing sensitivity. . In addition, with high vacuum metal Sealing at a low temperature using a eutectic reaction with Si also greatly increases the degree of vacuum. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/RU-2784820-C1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006010411-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4746611-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4570912-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007147408-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10384931-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007536105-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007313594-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006231506-A |
| priorityDate |
1999-11-01^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |