| abstract |
[PROBLEMS] To provide an electronic component device having a reduced external size, reliability accompanying improvement in airtightness, improvement in productivity by reducing the number of manufacturing steps, and low cost, and a method for manufacturing the same. An electronic component device according to the present invention includes a resin base (1) integrally formed with a lead portion (3) (lead frame). And at least one chip 2 made of a piezoelectric substrate is mounted on the resin base 1 and electrically and directly or indirectly connected to the internal lead 3c (bonding pad) exposed on the resin base 1 by the bonding wire 4. By providing the resin cap 5 protected by the hollow area A on the chip 2 and joining the resin cap 5 and the resin base 1, compared to a conventional electronic component device using a ceramic package or the like, Reduce the number of processes in It can be provided at low cost. |