http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001205479-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d5d04736b0b882a4f5a1e0e0e4cd8cbb |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-363 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 |
| filingDate | 2000-01-19^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_450ca765cc19807d1b9b818f2f4fdf85 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_20c881d520099a0aaf5b7f14a23b72b0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_329ed8caaa603682286660a4f4c44a83 |
| publicationDate | 2001-07-31^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2001205479-A |
| titleOfInvention | Soldering flux and solder paste |
| abstract | (57) [Summary] [PROBLEMS] A flux that ensures good wettability between a base material and solder, a solder paste that has excellent storage stability, a fine pitch, and a high reliability that responds to diversification of parts. A soldering method and a joint are provided. SOLUTION: A compound containing a nitroxide radical and / or N-oxide as a reducing agent is added to the flux. Particles of 20 μm or less in the solder powder are 30% or less in number distribution, and the oxygen content is 500 ppm. Hereinafter, the water content in the solder paste is set to 0.5 wt% or less. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109563453-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109563453-A |
| priorityDate | 2000-01-19^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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