| abstract |
(57) [Problem] To provide an epoxy resin composition excellent in moldability, flame retardancy, room temperature storage property, and solder stress resistance. SOLUTION: (A) 4,4'-dihydroxy-3, Glycidyl etherified product of 3 ', 5,5'-tetramethylbiphenyl (a) and bis (3,5-dimethyl-4- An epoxy resin which is a glycidyl etherified product of (hydroxyphenyl) methane (b), (B) a phenolic resin represented by the general formula (1), (C) all inorganic substances, (D) tetra-substituted phosphonium (P) and one molecule. A molecular association (M) with a conjugate base of a compound (Q) having two or more phenolic hydroxyl groups and a compound (Q) having two or more phenolic hydroxyl groups in one molecule, wherein the conjugate base is Compound (Q) having two or more phenolic hydroxyl groups in the molecule A curing accelerator consisting of a phenoxide-type compound from which one hydrogen has been removed as an essential component, the weight ratio (a / b) of (a) to (b) is 1/3 to 3, and all inorganic substances are all epoxy An epoxy resin composition for semiconductor encapsulation, wherein the content is 87 to 94% by weight in the resin composition. Embedded image (N is an average value and a positive number from 1 to 10) |