| abstract |
PROBLEM TO BE SOLVED: To provide a high-frequency circuit device capable of sufficiently reducing transmission loss at a connection between a semiconductor element and a microstrip line and sufficiently maintaining reliability at the connection. . SOLUTION: A metal bump 11 such as gold or copper is formed in advance on a bonding pad 9 on a high-frequency semiconductor substrate 4, and a plurality of bonding wires 7 are bonded via the metal bump 11. , To reduce the damage of the bonding pad 9 due to ultrasonic waves. [Effect] Since the metal bumps 11 having a large bonding area are joined, the joining of the high-frequency circuit board 6 to the high-frequency transmission line 5 is ensured. Therefore, even in the high-frequency circuit board 6 made of an organic material, There is an effect of improving connection reliability, and since there is no generation of a tail, transmission loss due to radiation can be reduced, and thus there is an effect of reducing variation in transmission characteristics. |