http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001237385-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_60e21de07fa18fc54e2150daffc14654
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-203
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G11B5-851
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L43-08
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G11B5-73
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filingDate 2000-02-24^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e5c7dd82c74e9a093f791708c570d872
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publicationDate 2001-08-31^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2001237385-A
titleOfInvention Microstructure device, manufacturing method thereof, and high-density magnetic storage device
abstract (57) Abstract: In a process of forming a microstructure, an ultra-fine magnetic structure in a magnetic storage medium having a density exceeding 100 Gbit / inch2 is used in a method of performing processing such as etching and lift-off on a deposited thin film. Could not be miniaturized while securing a sufficient thickness for storage. SOLUTION: The microstructure device 10 has a structure in which a Si substrate 1 having a convex portion surrounded by a steep slope and a microstructure 3 on the upper surface of the convex portion. The surface of the Si substrate 1 has irregularities, and the convex portions of the irregularities are surrounded by a steep slope. The fine structure 3 is formed on the upper surface of the projection via the mask pattern 2. The mask pattern 2 is formed on the Si substrate 1 by, for example, ECR chlorine plasma processing. This is an oxide film pattern for leaving the surface of the substrate as a projection when forming irregularities on the surface of the substrate.
priorityDate 2000-02-24^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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