| abstract |
PROBLEM TO BE SOLVED: To improve solubility and stability at the time of preparing a resist composition, reduce the amount of solvent remaining in the resist film at the time of forming the resist, and furthermore, it is uniform and dense, and the residual film ratio , A liquid photoresist resin composition for printed wiring boards having improved characteristics such as line width uniformity and adhesion of a resist film during development. SOLUTION: At least one selected from the group consisting of 1,3-propanediol alkyl ether, 1,3-propanediol alkyl ether acetate, 1,3-propanediol dialkyl ether, and 1,3-propanediol diacetate is provided. It comprises a solvent contained as a main solvent and a modified copolymer. |