| abstract |
PROBLEM TO BE SOLVED: To obtain excellent adhesion to a substrate in forming a pattern at the time of development and to obtain a good fine pattern of a heat-resistant resin. SOLUTION: (A) An alkoxysilane compound having an arylamino group or a pyridyl group in a molecular structure, (B) a heat-resistant resin having a phenolic hydroxyl group or a carboxyl group in the molecular structure, or a precursor thereof, A photosensitive resin composition containing (C) a photoinitiator selected from the group consisting of a photopolymerization initiator and a quinonediazide compound, and (D) a diluting solvent is produced. |