| abstract |
(57) [Abstract] (With correction) [Problem] With the increase in capacity of electronic equipment, a semiconductor device for fixing a laminated semiconductor chip to an inner lead and sealing it is thin, inexpensive, and of good quality. to be. SOLUTION: Main surfaces 10a and 12a and back surfaces 10b and 12 are provided. b, the first and second semiconductor chips 10 each having 12, one surface 10a of the laminated semiconductor chip in which the back surfaces 10b, 12b are fixed to each other is fixed to the second surface 14b of the inner lead 14, and the rising linear portion of the gold wire 16 on the ball bond side is the thickness of the semiconductor chip 10, 12. The external lead 19 is pulled up in parallel with the side surface in the direction and the thickness side surface of the inner lead 14 and wire-bonded, covered with the sealing resin 17, and the external lead 19 projects from the sealing resin 17 side surface. |