| abstract |
(57) [Summary]nThe present invention relates to a CMP slurry system used for manufacturing semiconductors. This slurry system consists of two components. The first component is a common dispersion containing only the abrasive and, optionally, a surfactant and a stabilizer. This general dispersion can be used to polish metals and intra-layer dielectrics (ILDs). The second component is at least two components selected from the group consisting of oxidizing agents, acids, amines, chelating agents, compounds containing fluorine, corrosion inhibitors, buffers, surfactants, biological agents, and mixtures thereof. A novel activator solution comprising: |