| abstract |
(57) [Summary] [PROBLEMS] There has been a problem that a solder connection between a conventional chip contact surface and a housing is broken due to a difference in thermal expansion coefficient. SOLUTION: The housing has a housing bottom, and a lower surface of the housing bottom carries a housing contact element that contacts the outside, and an upper surface of the housing bottom is electrically connected to a circuit contact element on a lower surface of a circuit. A housing lid is provided, in particular facing the housing bottom, the housing lid resiliently pressing the circuit with the circuit contact elements against the upper surface of the housing bottom and providing them between the circuit contact elements and the housing bottom. The problem is solved by a small circuit housing without a connection that permanently secures the material together. |