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filingDate 2002-03-28^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_518655d832f72f095316471de95f6c94
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publicationDate 2003-02-12^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2003039184-A
titleOfInvention Laser processing method
abstract (57) [Problem] To provide a laser processing method capable of cutting an object to be processed without causing the surface of the object to be melted or cracking out of a line to be cut. A laser processing method according to the present invention includes a step of fixing an object to be processed 1 on a sheet (film) having adhesiveness on the surface, and a laser beam by aligning a condensing point P inside the object to be processed 1. After irradiating the light L, forming the planned cutting portion by the modified region inside the processed object 1 along the planned cutting line 5 of the processed object 1, and after forming the modified region serving as the planned cutting portion, A step of applying stress to the workpiece 1 through the sheet by the pressing member and cutting the workpiece 1.
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