| abstract |
PROBLEM TO BE SOLVED: To provide an adhesive which gives a flexible copper-clad laminate, a cover lay, and a film adhesive exhibiting excellent flame retardancy without containing halogen and having excellent heat resistance and moisture resistance. . SOLUTION: (A) at least one kind of polyamideimide compound, (B) at least one kind of polyepoxide compound, (C) at least one kind of phosphazene compound and (D) an inorganic filler are essential components. The phosphazene compound (C) in an amount of 2 to 50% by weight. Halogen-free flame-retardant adhesive composition comprising a halogen-free flame-retardant adhesive composition as an essential component, and a coverlay, a film adhesive and a flexible copper using the same. It is a laminated board. |