| abstract |
A conductive film pattern and a method of forming the conductive film pattern, and a wiring substrate, an electronic device, and an electronic apparatus using the conductive film pattern, which can improve the method of forming a conductive film pattern and achieve more efficient thickening. , As well as a contactless card medium. A step of forming a microvoid type receiving layer above a substrate, and a step of forming a liquid (droplet) containing at least one of conductive fine particles and an organometallic compound into the receiving layer. A step of providing the conductive fine particles 3 and the organometallic compound, or a step of providing the conductive fine particles 3 and the organometallic compound on the receiving layer 2 or on the receiving layer 2 and in the receiving layer 2. Forming a conductive pattern 4. [Selection diagram] Fig. 1 |