| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b3310ea86f3c492f6c09d7be6592866d |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-111
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-1216
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-183 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K101-42 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01C17-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-351
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01C17-242
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-361
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
| filingDate |
2003-04-07^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_41d9a6676df4b00bef26a031d74d0016
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d5cf25f552ef3f99a08bede851e3558a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bca786fad7adbecc50a59a4359a24efb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9f6d36b1e87a16421219c622a47226da
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d6909ea1875662b207c5a95061240a62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9610139466c6b7e3b69d50faf0265b0d |
| publicationDate |
2004-01-22^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2004023094-A |
| titleOfInvention |
Printed circuit board having built-in register, manufacturing method thereof, and optimization method thereof |
| abstract |
To provide a printed circuit board having a built-in resistor, a manufacturing method thereof, and an optimization method thereof capable of realizing a desired resistance value through an economical and mass-productive process without investment of new equipment. . Forming at least a pair of patterned resistor metal pads 102 spaced apart from each other on a resin-based insulating substrate, and forming a thick film resistor 103 between the resistor metal pads. Electrically connecting the thick film resistors to the respective resistor metal pads 102; measuring resistance values of the resistors; and spot machining per laser 107 from a deviation of the target resistance value relative to the measured resistance value. A step of determining a quantity, a step of selectively performing laser spot processing of the register with the determined laser spot processing amount several times so as to have a target resistance value, and the spot-processed register and register pad Forming a solder resist or cover coat layer 108 on the substrate to cover the substrate. [Selection] Figure 2 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011243940-A |
| priorityDate |
2002-06-12^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |