| abstract |
An object of the present invention is to provide a polishing agent and a polishing method suitable for a substrate having a wiring metal film and a barrier film formed on an insulating film, particularly in a second polishing step for removing the barrier film. One or more selected from the group consisting of (A) oxide fine particles, (B) monosaccharides, oligosaccharides having 2 to 20 monosaccharides bonded thereto, sugar alcohols thereof, and sugar esters thereof ( C) A polishing agent containing a specific triazole compound and (D) water. [Selection] Figure 1 |