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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-022
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filingDate 2002-12-20^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_23cfb055bf88286becaa503a8173bab7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ac0718ae5232ffcd9bd7648780e409bc
publicationDate 2004-07-15^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2004198944-A
titleOfInvention Resist material and pattern forming method
abstract (A) A polymer compound having a repeating unit of the formula (1) and having an acid labile group, Embedded image (B) an acid generator such as (5- (4-methylphenyl) sulfonyloxyimino-5H-thiophen-2-ylidene)-(2-methylphenyl) acetonitrile; (C) A resist material containing benzotriazoles and having an ultraviolet light having a wavelength of 300 nm or more as an exposure light source. EFFECTS OF THE INVENTION By using the composition of the present invention, particularly when forming a thick positive resist pattern by exposure to ultraviolet rays of 300 nm or more on a metal-coated substrate, high sensitivity and high resolution can be obtained. A resist pattern can be formed stably. [Selection diagram] None
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