http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004224871-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
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filingDate 2003-01-21^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1e6952b19693b1a6694422176309eadd
publicationDate 2004-08-12^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2004224871-A
titleOfInvention Curing agent composition for flame-retardant epoxy resin, flame-retardant epoxy resin composition using the curing agent composition for flame-retardant resin, and semiconductor device
abstract A curing agent composition for a flame-retardant epoxy resin which can provide excellent flame retardancy, good curability, fluidity, and storage stability without containing a halogen compound and an antimony compound. Provided are an epoxy resin composition and a semiconductor device having excellent solder crack resistance and moisture resistance reliability. Kind Code: A1 A compound (A) having a phenolic hydroxyl group and an ionic bond between an iron atom and a phenoxide group, a coordination bond between an iron atom and an oxygen atom of a carbonyl group, or a bond between an iron atom and an oxygen atom of a sulfone group. A compound comprising an iron compound (B) having at least one or more coordination bonds, and heating and mixing at a temperature equal to or higher than the softening point of the compound (A) having two or more phenolic hydroxyl groups in one molecule. The curing agent composition for a flame-retardant epoxy resin to be used.
priorityDate 2003-01-21^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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