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filingDate 2003-01-22^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_da28e0b258510c1bc99b28b7417d04e0
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publicationDate 2004-08-12^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2004228314-A
titleOfInvention Semiconductor device having pad
abstract A semiconductor device having a pad that does not require cleaning and polishing of a probe needle is provided. In a semiconductor device having a pad according to the present invention, a first conductor and a second conductor are arranged on a surface of a pad. The first conductor 1a has a hardness higher than the hardness of the second conductor 1b and a hardness equal to or higher than the hardness of the probe needle 11. The first conductor 1a is arranged on the surface of the pad 1 so that the probe needle 11 contacts the first conductor 1a at least once while the probe needle 11 contacts the surface of the pad 1 and slides on the surface of the pad 1. [Selection diagram] Fig. 1
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006086244-A
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