| abstract |
PROBLEM TO BE SOLVED: To provide a lead frame manufacturing method for manufacturing a lead frame made of a copper alloy that can prevent the occurrence of delamination caused by the lead frame and does not impair the bondability irrespective of the IC assembly conditions. To do. A surface of a copper portion made of a copper alloy material, subjected to partial noble metal plating made of at least one of silver, gold, and palladium for wire bonding or die bonding, and at least in contact with a sealing resin A partial noble metal plating method for a lead frame for a resin-encapsulated semiconductor device in which a thin noble metal plating made of at least one of silver, gold, platinum, and palladium is applied to all or a predetermined portion of In order, (A) a step of performing copper plating on the surface of the lead frame material made of a copper alloy that has undergone external processing, and (B) a thin noble metal plating is applied to all or a predetermined portion of the surface of the lead frame that has been subjected to copper plating. And (C) a step of performing partial noble metal plating. [Selection] Figure 4 |