| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0ddb9f3656270bc5410be3679322fead |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-088 |
| filingDate |
2004-05-20^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d1796445e063ba17e107e08bd93cdd8e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7e6190cc58869aa8800bde44f1a30f53
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b87c23f8a5120ca434a57127639a1f17
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_44e53f1d5e0ecc1e19bc04a31eb398bb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_951eac4d42a2c7c2bcf6fb788bdb44f2 |
| publicationDate |
2005-01-06^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2005001384-A |
| titleOfInvention |
LAMINATE AND PRINTED WIRING BOARD MANUFACTURING METHOD |
| abstract |
【Task】 Provided is a printed wiring board capable of forming a high-density circuit and having excellent adhesiveness and adhesion reliability in a high-temperature and high-humidity environment. [Solution] By using a laminate composed of a thermoplastic polyimide resin containing an organic thiol derivative compound and a metal thin film by a physical method, a plated film with excellent adhesion is formed on a smooth surface, and this is used to form a high-density circuit. Form. By producing a printed wiring board using this laminate, it is possible to form a high-density printed wiring board and realize excellent adhesion and excellent adhesion reliability in a high-temperature and high-humidity environment. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017132898-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11760838-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018150544-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11118013-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110718317-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015027777-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007084463-A |
| priorityDate |
2003-05-20^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |