http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005017666-A

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filingDate 2003-06-26^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_29271fd84b44087736fc74a1d4c36a91
publicationDate 2005-01-20^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2005017666-A
titleOfInvention Photosensitive resin composition
abstract In a photosensitive resin composition containing an alkali-soluble resin and a photosensitive agent, a thin film having good light transmittance can be obtained while maintaining the flatness of the film surface even after high-temperature baking, and stable over time. To provide a photosensitive resin composition that is particularly suitable for forming an interlayer insulating film, a planarizing film, and the like, and a flat panel display and a semiconductor element using the same. In a photosensitive resin composition containing an alkali-soluble resin, a sensitizer having a quinonediazide group, and a curing agent, the alkali-soluble resin is an acrylic resin, and the sensitizer having a quinonediazide group is represented by the following general formula (I): And a naphthoquinone diazide compound, wherein the curing agent contains an epoxy group. The photosensitive resin composition further contains a phenolic compound and a curing accelerator as necessary. (Wherein R 1 , R 2 , R 3 and R 4 each independently represent H or a C 1 -C 2 alkyl group, and R 5 and R 6 each independently represent C 1 -C 2. Represents an alkyl group of
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016173563-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010181827-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2015087831-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2015087831-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2012176750-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013130816-A
priorityDate 2003-06-26^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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