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publicationDate 2005-03-24^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2005079188-A
titleOfInvention Manufacturing method of electronic device
abstract PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic device having a low dielectric constant interlayer insulating film including an organic thin film having a relative dielectric constant of 2.0 to 2.4. SOLUTION: In a post-treatment of a base film forming step before forming an organic thin film by chemical vapor deposition or a pre-treatment of an organic thin film forming step, the surface of the base film has a contact angle of 50 ° with water. Adhesion between the inorganic film and the organic thin film is improved by using the above hydrophobic surface. Improvement in adhesion makes it possible to prevent defects such as film peeling and cracking during the multilayer wiring formation process, and an electronic device such as a semiconductor device having an organic thin film having a low dielectric constant can be provided. [Selection figure] None
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