http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006019358-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_24aca9ded2638ea793d05360dde7a4a0 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-00 |
| filingDate | 2004-06-30^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0bfa3cca42e4ae0d25d838f782157433 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_abbcbaf8393b171163a3d4fa04c7a250 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1f04cb5f660647d7e8031ae069ced384 |
| publicationDate | 2006-01-19^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2006019358-A |
| titleOfInvention | Aqueous dispersion for chemical mechanical polishing |
| abstract | PROBLEM TO BE SOLVED: To provide a chemical mechanical polishing (CMP) aqueous dispersion capable of polishing a metal film at a high speed during the manufacture of a semiconductor device having an integrated circuit and suppressing the etching rate of the metal film, and a method for manufacturing the same. I will provide a. An aqueous dispersion for chemical mechanical polishing comprising, as an active ingredient, polymer particles containing a structural unit derived from a monomer containing a functional group capable of forming a complex with a metal and an olefinic double bond. An aqueous dispersion for chemical mechanical polishing, wherein the total content of monomers and hydrolysis products derived from the monomer is 0.2 parts by weight or less with respect to 100 parts by weight of the aqueous dispersion And an aqueous dispersion containing polymer particles containing structural units derived from a monomer containing a functional group capable of forming a complex with a metal and an olefinic double bond. A method for producing an aqueous dispersion for chemical mechanical polishing, characterized in that the hydrolysis product derived from is removed by membrane separation. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016108542-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008041782-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007273680-A |
| priorityDate | 2004-06-30^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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