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publicationDate 2006-02-02^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2006026692-A
titleOfInvention Method for removing lead-free solder from slider pad and magnetic disk drive
abstract PROBLEM TO BE SOLVED: To provide a method for removing lead-free solder from a slider pad so that a head / slider used in a magnetic disk device can be reused. [Solution] The slider pad 104 provided on the head / slider 103 and the lead pad 235 are connected by a solder fillet 237 of lead-free solder. The cutting tool 309 is heated in advance to near the melting point of lead-free solder. The cutting tool 309 is moved in parallel with the surface of the slider pad 104 to cut while softening the solder fillet. The solder fillet is removed while the head / slider 103 can be reused without applying stress to the slider pad 104. [Selection] Figure 9
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